Facilities and Equipment
This section summarises the facilities employed for product and process development.
1500 sq.m.factory with 600 sq.m. clean room, chemistry & cat. 2 biolabs.
Equipped with design, fabrication and application testing capabilities covering:
- Shaping
- Electrode and optoelectronics integration
- Surface coating
- Macro to micro world interconnection, sealing and bonding
Foil and film (single sheet and roll to roll)
Precision wet coating, embossing (nanoimprinting), etching, plating, lamination
- R2R film wet coating / printing & UV embossing /imprinting
- R2R plasma machine (Q4 2008)
- R2R electroplating (Q1 2009)
R2R (reel to reel) film processing
- wet coating / printing (Read More – PDF download)
- Microstructured film using UV embossing / imprinting (Read More – PDF download)
- Film cleaning and corona treatment for adhesion enhancement
R2R (reel to reel) plasma
Etch / surface treatment 0.5 m/min; 3 µm/min etch; 2 gas lines
R2R (reel to reel) electroplating
(Au/Ni/Cu) typically @ (0.1/1.5/3.5 µm) 0.5-2.0 m/min
Boards and sheets:
Channels, wells, vias by precision machining, photochemical etching & moulding. Channel / well filling by printing, plasma, plating.
- Drilling / routing
- Electroplating (Q4 2008)
- Microstructure photochemical etching (microfluidics, microelectrodes)
Automated sheet processing
Drilling / routing
UV embossing /imprinting
On film, foil sheet (glass, polymer)
